1. Application of thermal conductive materials: Thermal management of power management chips often uses materials such as thermal conductive gels, thermal interface phase change materials and insulating thermal conductive sheets. Thermal gel has high fluidity and high filling performance, suitable for automated dispensing process, can fill fine voids and provide low thermal resistance, thermal conductivity between 2.0~8.0 W/m·K. Thermal interface phase change materials soften and fully fill microscopic voids at specific temperatures, optimize thermal contact properties, and have extremely low thermal resistance for high power density applications. The insulating thermal conductive sheet is reinforced with glass fiber cloth, which has thermal conductivity, high pressure resistance and puncture resistance. The compressive strength can reach more than 10kV, and the thermal conductivity is 1.0~ 1.6W /m·K.

2. Liquid cooling technology: liquid cooling cycle technology is used for the thermal management of DC charging piles, and the temperature of charging piles can be effectively reduced through the liquid cooling system to improve charging efficiency and safety. The liquid cooling technology absorbs heat through the coolant and circulates it to the radiator, which is cooled by the fan and then circulates again to achieve efficient heat exchange.

3. Heat dissipation structure patent: Wasion Information Technology Co., Ltd. applied for the patent "a heat dissipation structure and heat dissipation system for DC charging pile" involving the field of electric vehicle charging technology, through the heat dissipation structure of the host to carry out linkage heat dissipation of the charging gun, reduce the heat dissipation operation cost of the charging pile to the charging gun, and improve the heat dissipation effect of the charging gun.