Electrical Conductivity:
Metal Coating: The metallic layer (often made of materials like copper, aluminum, or silver) provides electrical conductivity, allowing the film to serve as an effective conductive layer in grounding applications. Grounding Efficiency: These films can help effectively dissipate electrical energy, providing a low-resistance path to ground.

Thermal Stability:
High-Temperature Resistance: Polyimide films are known for their excellent thermal stability, being resistant to high temperatures (up to 260°C / 500°F). This property is crucial for grounding applications in high-temperature environments.
Low Thermal Expansion: The low coefficient of thermal expansion ensures dimensional stability when subjected to temperature fluctuations.

Chemical Resistance:
Resistant to Chemicals: Polyimide films are durable against various chemicals, including oils, solvents, and acids, making them suitable for use in diverse environments where exposure to harsh chemicals may occur.

Mechanical Strength:
Flexibility and Strength: Metalized polyimide films offer a good balance of flexibility and strength, allowing them to be used in applications where they might experience mechanical stress or deformation.

Insulating Properties:
Dielectric Strength: While the metal layer conducts electricity, the underlying polyimide film provides excellent electrical insulation, allowing for the careful design of multi-layered grounding solutions where insulation and conduction are required.
ience movement or stress.