• +8617722959228
  • mango@esscollege.com
  • China

IGBT packaging materials

The inverter in uninterruptible power supply (UPS) system is the key component to convert DC to AC, and the IGBT is one of the core components in the inverter. Insulated-gate bipolar transistor (IGBT) is an important power switching device, and the selection and application of its packaging materials are becoming more and more important. IGBT packaging not only affects the performance, reliability and heat dissipation efficiency of the device, but also affects the healthy operation of the entire power electronic system. The following will introduce IGBT packaging materials.

Packaging materials

The packaging material is the external material used to protect and support the IGBT chip, and its main functions include providing electrical insulation, mechanical support, environmental protection, and good thermal management.

Epoxy

This material has good electrical insulation and mechanical strength, which can effectively protect the chip from the external environment. Epoxy resins can also increase their mechanical strength and thermal stability by adding reinforcing materials, such as glass fibers.

Polyimide

Polyimide is a high-temperature material that can withstand high temperature environments. It has good electrical insulation and chemical resistance, suitable for applications in harsh environments.

Ceramic materials

Ceramic packaging materials are another important IGBT packaging option, especially for high power and high temperature applications. Some high power IGBTs use ceramic packaging materials, which provide higher thermal conductivity and better sealing capability, helping to improve the thermal management capability of IGBTs.

Cooling material

Cooling materials play a crucial role in IGBT packages, as long periods of high power operation can cause device temperatures to rise, affecting performance and life. The choice of heat dissipation material is directly related to the operating temperature and heat dissipation efficiency of IGBT.

Metal radiator

The IGBT package usually has a metal base, which effectively improves the transfer and dissipation of heat. Aluminum and copper are commonly used heat dissipation materials with good thermal conductivity.

Heat transfer adhesive

This adhesive not only provides good thermal conductivity, but also fills the tiny contact gap between the chip and the heat sink, improving the heat transfer efficiency. Thermal conductive adhesives usually have good adhesion and electrical insulation.

CONCLUSION

The IGBT's packaging and cooling materials play a crucial role in its performance and reliability. Through careful selection and design of packaging and cooling solutions, the efficiency and stability of IGBTs can be significantly improved.

UPS BATTERY SERIES

UPS (Uninterruptible Power Supply) batteries are an important component of power supply systems designed to provide stable power support for electronic devices.

Read More

Extended reading

THE ESSC Brand promise

Global supply

Our products sell well all over the world, covering many countries and regions, through the global logistics network, to provide customers with convenient purchasing experience.

Rigorous quality

We adhere to the highest quality control standards to ensure every product meets industry regulations and customer expectations, earning trust through consistent excellence.

Excellent service

With a customer-centric approach, we provide prompt responses, professional support, and personalized services, aiming to deliver the best user experience and long-term value.

QUICK INQUIRY

Please enable JavaScript in your browser to complete this form.
Name